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upi confidential up1723 1 up1723-ds-p0001, jan. 2015 www.upi-semi.com ?? ?? ? 4.5v to 18v input voltage range ?? ?? ? 2a output current ?? ?? ? accurate reference: 0.925v (+/- 1.5%) ?? ?? ? up to 93% conversion efficiency ?? ?? ? integrated low r ds(on) upper and lower mosfet switches: 130m ? ? ?? ?? ? current mode pwm operation ?? ?? ? 340khz fixed-frequency operation ?? ?? ? programmable soft-start ?? ?? ? integrated boot diode ?? ?? ? over voltage and under voltage protection ?? ?? ? over current and over temperature protection ?? ?? ? frequency decay mode during uvp ?? ?? ? sop-8l, psop-8l, pmsop-8l and pmsop-10l package ?? ?? ? rohs compliant and halogen free rebmunredr oe pytegakca pg nikram pot 8asp3271p ul 8-po sp 3271pu 8usp3271p ul 8-pos pp 3271pu 8urp3271p ul 8-posm pp 3271pu aurp3271p ul 01-posm pp 3271pu 2a, 18v, high-efficiency synchronous-rectified buck converter ?? ?? ? battery-powered portable devices ?? ?? ? mp3 players ?? ?? ? digital still cameras ?? ?? ? wireless and dsl modems ?? ?? ? personal information appliances ?? ?? ? 802.11 wlan power supplies ?? ?? ? fpga/asic power supplies ?? ?? ? laptop, palmtops, notebook computers ?? ?? ? portable information appliances general description applications ordering information features the up1723 is a high-efficiency synchronous-rectified buck converter with internal power switch. with internal low r ds(on) switches, the high-efficiency buck converter is capable of delivering 2a output current over a wide input voltage range from 4.5v to 18v. the output voltage is adjustable from 0.8v to 15v by a voltage divider. other features for the buck converter include adjust soft-start, chip enable, over-voltage, under-voltage, over- temperature and over-current protections. it is available in a space saving sop-8l, psop-8l, pmsop-8l and pmsop-10l packages. note: (1) please check the sample/production availability with upi representatives. (2) upi products are compatible with the current ipc/ jedec j-std-020 requirement. they are halogen-free, rohs compliant and 100% matte tin (sn) plating that are suitable for use in snpb or pb-free soldering processes. 12 3 45 6 7 8 sop C 8l vin lx boot gnd com p en ssfb nc 1 2 3 4 5 6 7 8 9 10 pmsop C 10l vin lx boot gnd comp en ssfb nc gnd gnd 12 3 45 6 7 8 psop C 8l vin lx boot gnd com p en ssfb pmsop - 8l 1 2 3 4 5 6 7 8 vin lx boot gnd com p en ssfb gnd pin configuration
upi confidential up1723 2 up1723-ds-p0001, jan. 2015 www.upi-semi.com typical application circuit boot fb comp ss vin 4.5v~18v v out vin gnd l1 c in 10ufx2 en r 4 100k lx c ss 0.1uf c boot 10nf r 3 c 2 r 2 r 1 c out 22ufx2 c 3 option c 1 option r 5 * v ni v tuo c ni 1 lc tuo c 1 c 2 r 1 r 2 r 3 v2 1v 2. 12 xfu0 1h u2. 22 xfu2 2f p2 2f n5. 1k 3k 0 1k 7.4 v2 1v 8. 12 xfu0 1h u2. 22 xfu2 2f p2 2f n5. 1k 35. 9k 0 1k 2.6 v2 1v 5. 22 xfu0 1h u8. 62 xfu2 2f p2 2f n5. 1k 9.6 1k 0 1k 2.8 v2 1v 3. 32 xfu0 1h u0 12 xfu2 2f p2 2f n5. 1k 1.6 2k 0 1k 01 v2 1v 52 xfu0 1h u5 12 xfu2 2f p2 2f n5. 1k 2.4 4k 0 1k 31 edom gnivasrewo pe domrewoplluf v ni 4 r5 rn e v4 r5 rn ev v5. 4k 00 1c nv 04. 4k 00 1k 08 1v 98.2 v0. 5k 00 1c nv 08. 4k 00 1k 03 1v 28.2 v0. 9k 00 1k 01 1v 17. 4k 00 1k 7 4v 78.2 v2 1k 00 1k 2 6v 95. 4k 00 1k 0 3v 67.2 v5 1k 00 1k 3 4v 15. 4k 00 1k 2 2v 07.2 bom list for en pin application: note: * check bom list for en pin application table below.
upi confidential up1723 3 up1723-ds-p0001, jan. 2015 www.upi-semi.com .onnip emanni pn oitcnufnip /8asp /8usp 8urp aurp - -3 , 1c n .detcennoclanretniton 12 t oob .revird etagreppu gnitaolfehtrofylppus partstoob partstoobehttcennoc croticapac toob eht.tiucricpartstooba mrofotnipxlehtdnaniptoobneewteb eulavlacipyt.tefsomreppuehtnonrutotegrahcehtsedivor proticapacpartstoob crof toob ctahterusne.retaergrofn01si toob .ciehtraendecalpsi 24 n iv tupniylppusrewop dnaegatlovtuptuoehtottnerrucseilppustahtegatlovtupn i. 2xfu01 muminim ahtiwegatlovtupniehtssapyb.tiucriclortnoclanretnieh tsrewop .roticapaccimarecr7xror5x 35 x l .tuptuosehctiwslanretni .rotcudnituptuoehtotnipsihttcennoc 46 d ng .dnuorg .retrevnockcubehtfodnuorg 57 b f .egatlovkcabdeefrehctiws bf.reifilpmarorreehtfotupnignitrevniehtsinipsiht .krowtenredividrotsiserlanretxenahguorhttuptuorehct iwsehtsesnes 68 p moc .noitasnepmoc r otarapmoctnerruceht.reifilpmarorreehtfotuptuosinips iht r ofdnuorgotkrowten crnatcennoc.egatlovlortnocsihthtiwsesaercnidlohserh t .noitasnepmocpoollortnoc 79 n e .)hgihevitca(elbaneretrevnockcub .retrevnocehtnwodstuhswolcigol 80 1s s .niplortnoctrats-tfos croticapactratstfosatcennoc ss r ofnepoevael.nipsihtot n ipnenehwdnuorgotdegrahcsidsiroticapactratstfoseht.n oitacilppatrats-tfoson .wolsi dapdesopxe .dnuorg .retrevnockcubehtfodnuorg functional pin description functional block diagram ss control logic & protect logic driver current sense current limit detector slope compensation v ref gnd vin lx fb 6ua comp boot internal regulator va v cc va 1.1v 0.4v ov uv v ref otp ot en logic en en por por por
upi confidential up1723 4 up1723-ds-p0001, jan. 2015 www.upi-semi.com functional description the up1723 is a high efficiency synchronous-rectified buck converter with internal power switches. with internal low r ds(on) switches, it is capable of delivering 2a output current over a wide input voltage range from 4.5v to 18v. the output voltage is adjustable from 0.925v to 15v by a voltage divider. other features include programmable soft- start, chip enable, overvoltage, under-voltage, over- temperature and over-current protections. input supply voltage vin supplies current to internal control circuits and output voltages. the supply voltage range is from 4.5v to 18v. a power on reset (por) continuously monitors the input supply voltage. the por level is typically 4.0v at vin rising. the buck converter draws pulsed current with sharp edges each time the upper switch turns on, resulting in voltage ripples and spikes at supply input. a minimum 10ufx2 ceramic capacitor with shortest pcb trace is highly recommended for bypassing the supply input. enable control with operation mode setting pulling en pin lower than 1.2v shuts down the buck converter and reduces its quiescent current lower than 1ua. in the shutdown mode, both upper and lower switches are turned off. as shown in table 1, to set the buck converter in the full power mode by pulling en pin between 2.4v and 3v. pulling en pin higher than 3.8v to set the buck converter in the power saving mode. table 1. mode table selection gnisir n ee dom v3 upi confidential up1723 5 up1723-ds-p0001, jan. 2015 www.upi-semi.com functional description output voltage setting and feedback network for the adjustable output version, the output voltage can be set from vref to vin by a voltage divider as: () 2r 2r 1r 925 .0 v out + = the internal vref is 0.925v with 1.5% accuracy. in real applications, a 22pf feed-forward ceramic capacitor is recommended in parallel with r1 for better transient response. over temperature protection the otp is triggered and shuts down the up1723 if the junction temperature is higher than 150 o c. the otp is a non-latch type protection. the up1723 automatically initiates another soft start cycle if the junction temperature drops below 120 o c. current limit function the up1723 continuously monitors the inductor current for current limit by sensing the voltage drop across the upper switch when it turns on. when the inductor current is higher than current limit threshold (4a typical), the current limit function activates and forces the upper switch turning off to limit inductor current cycle by cycle. if the load continuously demands more current than what up1723 could provide, up1723 will not be able to regulate the output voltage, and the output voltage will drop accordingly. eventually, under voltage protection will be triggered if v fb is lower than uvp threshold. when the output is shorted to ground, the current limit function activates immediately, and vout will be pulled down very fast. eventually the under voltage protection will be triggered, and the ic will shut down to protect external components. the ic will restart after the uvp retry delay, and the above behavior may repeat if the output short condition is not released. this is the so-called short circuit protection (scp). under voltage protection the up1723 continuously monitors fb voltage for under voltage protection. when v fb < 0.4v (typical), the up1723 triggers under voltage protection and enters frequency decay mode which the switching frequency of the up1723 will decrease linearly according to the fb voltage drop. eventually when v fb = 0v, the switching frequency of the up1723 will be clamped at 100khz. after triggering uvp, the ss voltage is also discharged to 0v. after v ss = 0v, the up1723 will try to re-soft-start to establish the output voltage once again. in the end of re-soft-start (v ss = 1.2v), if the uvp condition is still not relieved, the up1723 will turn-off all high-side and low-side mosfets and re-try to soft start every 8ms. over voltage protection the up1723 continuously monitors fb voltage for over voltage protection. when v fb > 1.1v (typical), the up1723 triggers over voltage protection and the low-side mosfet is turned on while high-side mosfet is turned off to discharge the output voltage. at any time if the ovp condition is relieved, the up1723 will restart the soft start sequence.
upi confidential up1723 6 up1723-ds-p0001, jan. 2015 www.upi-semi.com (note 1) supply input voltage, v in ----------------------------------------------------------------------------------------- -0.3v to +20v lx pin voltage dc --------------------------------------------------------------------------------------------------------------- -0.3v to +(v in +0.3v) <50ns ------------------------------------------------------------------------------------------------------------------- -3.5v to + 25v boot pin voltage -------------------------------------------------------------------------------------------------------- -0.3 v to (v in +6.0v) other pi ns ------------------------------------------------------------------------------------------------------------------- ----- -0.3v to +6.0v storage temperature range ----------------------------------------------------------------------------------------------- -65 o c to +150 o c junction temperature --------------------------------------------------------------------------------------------------------------------- 150 o c lead temperature (soldering, 10 sec) ------------------------------------------------------------------------------------------------ 260 o c esd rating (note 2) hbm (human body mode) -------------------------------------------------------------------------------------------------------- 2kv mm (machine mode) ---------------------------------------------------------------------------------------------------------------- 200v (note 5) operating junction temperature ra nge --------------------------------------------------------------------- -40 o c to +125 o c operating ambient temperature ra nge ---------------------------------------------------------------------------------- -40 o c to +85 o c absolute maximum rating thermal information recommended operation conditions package thermal resistance (note 3/4) sop - 8l ja ---------------------------------------------------------------------------------------------------------------- 160 o c/w sop - 8l jc ----------------------------------------------------------------------------------------------------------------- 39 o c/w psop - 8l ja ---------------------------------------------------------------------------------------------------------------- 47 o c/w psop - 8l jc ------------------------------------------------------------------------------------------------------------- 17.9 o c/w pmsop - 8l ja ------------------------------------------------------------------------------------------------------------- 86 o c/w pmsop - 8l jc ------------------------------------------------------------------------------------------------------------ 30 o c/w pmsop - 10l ja ---------------------------------------------------------------------------------------------------------- 160 o c/w pmpsop - 10l jc --------------------------------------------------------------------------------------------------------- 40 o c/w power dissipation, p d @ t a = 25 o c sop - 8l ----------------------------------------------------------------------------------------------------------------------------- 0.63w psop - 8l --------------------------------------------------------------------------------------------------------------------------- 2.13w pmsop - 8l ------------------------------------------------------------------------------------------------------------------------- 1.16w pmsop - 10l ----------------------------------------------------------------------------------------------------------------------- 0.63w electrical characteristics (v in = 12v, t a = 25 o c, unless otherwise specified) retemara pl obmy ss noitidnoctse tn i mp y tx am s tinu tupniylppus dlohserhtrop ni vv htrni 8. 32 . 45 . 4v siseretsyh rop ni vv syhni - -2 3. 0- -v tnerructnecseiu qv ne v,v5= bf gnihctiwson,v1 =- -8 . 02 . 1a m tnerrucnwodtuh si ds v ne 0 =- -5 . 03a u
upi confidential up1723 7 up1723-ds-p0001, jan. 2015 www.upi-semi.com note 1. stresses listed as the above absolute maximum ratings may cause permanent damage to the device. these are for stress ratings. functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. exposure to absolute maximum rating conditions for extended periods may remain possibility to affect device reliability. note 2. devices are esd sensitive. handling precaution recommended. note 3. q ja is measured in the natural convection at t a = 25 o c on a low effective thermal conductivity test board of jedec 51-7 thermal measurement standard. note 4. the case temperature location for measuring jc is on the top of the package. note 5. the device is not guaranteed to function outside its operating conditions. retemara pl obmy ss noitidnoctse tn i mp y tx am s tinu egatlovkcabdeef egatlovkcabdee fv bf v upi confidential up1723 8 up1723-ds-p0001, jan. 2015 www.upi-semi.com v in (10v/div) i lx (2a/div) v out (10mv/div) lx (10v/div) v in (10v/div) lx (10v/div) v out (10mv/div) i lx (100ma/div) en (5v/div) i lx (2a/div) v out (2v/div) lx (10v/div) en (5v/div) i lx (2a/div) v out (2v/div) lx (10v/div) v in (5v/div) i lx (2a/div) v out (2v/div) lx (10v/div) v in (5v/div) i lx (2a/div) v out (2v/div) lx (10v/div) typical operation characteristics power on waveforms 4ms/div v in = 12v, v out = 3.3v, i out = 2a power off waveforms 20ms/div v in = 12v, v out = 3.3v, i out = 2a turn on waveforms 4ms/div v in = 12v, v out = 3.3v, i out = 2a turn off waveforms 400us/div v in = 12v, v out = 3.3v, i out = 2a steady state waveforms 100us/div v in = 12v, v out = 3.3v, i out = 0a at psm steady state waveforms 2us/div v in = 12v, v out = 3.3v, i out = 2a at psm
upi confidential up1723 9 up1723-ds-p0001, jan. 2015 www.upi-semi.com 3.20 3.25 3.30 3.35 3.40 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0 10 20 30 40 50 60 70 80 90 100 0.01 0.1 1 10 v in = 12v v in = 5v lx (10v/div) i lx (2a/div) i out (2a/div) v out (2v/div) v out (100mv/div) lx (10v/div) i out (2a/div) v in (10v/div) load transient waveforms 200us/div v in = 12v, v out = 3.3v, i out = 0a current limit waveforms 100us/div v in = 12v, v out = 3.3v, i out = 2a typical operation characteristics output voltage vs. output current output current (a) v in = 12v, v out = 3.3v, i out = 0a ~ 2a output voltage (v) efficiency vs. output current output current (a) v in = 5v ~ 12v, v out = 3.3v, i out = 0a ~ 2a efficiency (%)
upi confidential up1723 10 up1723-ds-p0001, jan. 2015 www.upi-semi.com application information output inductor selection output inductor selection is usually based the considerations of inductance, rated current value, size requirements and dc resistance (dcr). the inductance is chosen based on the desired ripple current. large value inductors result in lower ripple currents and small value inductors result in higher ripple currents. higher v in or v out also increases the ripple current as shown in the equation below. a reasonable starting point for setting ripple current is ? il = 900ma (30% of 3000ma). for most applications, the value of the inductor will fall in the range of 1uh to 10uh. () ? ? ? ? ? ? ? ? ? = ? in out out out osc v v 1 v l f 1 il maximum current ratings of the inductor are generally specified in two methods: permissible dc current and saturation current. permissible dc current is the allowable dc current that causes 40 o c temperature raise. the saturation current is the allowable current that causes 10% inductance loss. make sure that the inductor will not saturate over the operation conditions including temperature range, input voltage range, and maximum output current. if possible, choose an inductor with rated current higher than 4.3a so that it will not saturate even under current limit condition. the size requirements refer to the area and height requirement for a particular design. for better efficiency, choose a low dc resistance inductor. dcr is usually inversely proportional to size. different core materials and shapes will change the size, current and price/current relationship of an inductor. toroid or shielded pot cores in ferrite or permalloy materials are small and dont radi ate much energy, but generally cost more than powdered iron core inductors with similar electrical characteristics. the choice of which style inductor to use often depends on the price vs. size requirements and any radiated field/emi requirements. input capacitor selection the buck converter draws pulsed current with sharp edges from the input capacitor resulting in ripple and noise at the input supply voltage. a minimum 10ufx2 x5r or x7r ceramic capacitor is highly recommended to filter the pulsed current. the input capacitor should be placed as near the device as possible to avoid the stray inductance along the connection trace. y5v dielectrics, aside from losing most of their capacitance over temperature, they also become resistive at high frequencies. this reduces their ability to filter out high frequency noise. the capacitor with low esr (equivalent series resistance) provides the small drop voltage to stabilize the input voltage during the transient loading. for input capacitor selection, the ceramic capacitor larger than 10ufx2 is recommend. the capacitor must conform to the rms current requirement. the maximum rms ripple current is calculated as: ? ? ? ? ? ? ? ? + ?= ? out osc c out c f 8 1 esr i v this formula has a maximum at v in = 2xv out , where i in (rms) = i out (max)/2. this simple worst-case condition is commonly used for design because even significant deviations do not offer much relief. note that the capacitor manufa cturers ri pple current ratings are often based on 2000 hours of life. this makes it advisable to further derate the capacitor, or choose a capacitor rated at a higher temperature than required. always consult the manufacturer if there is any question. using ceramic capacitors higher value, lower cost ceramic capacitors are now available in smaller case sizes. their high ripple current, high voltage rating and low esr make them ideal for switching regulator applications. because the control loop does not depend on the output capacitors esr for stable operation, ceramic capacitors can be used to achieve very low output ripple and small circuit size. however, care must be taken when these capacitors are used at the input and the output. when a ceramic capacitor is used at the input and the power is supplied by a wall adapter through long wires, a load step at the output can induce ringing at the input, v in . at best, this ringing can couple to the output and be mistaken as loop instability. at worst, a sudden inrush of current through the long wires can potentially cause a voltage spike at v in , large enough to damage the part. when choosing the input and output ceramic capacitors, choose the x5r or x7r dielectric formulations. these dielectrics have the best temperature and voltage characteristics of all the ceramics for a given value and size. checking transient response the regulator loop response can be checked by looking at the load transient response. switching regulators take several cycles to respond to a step in load current. when a load step occurs, v out immediately shifts by an amount equal to ( ? i out x esr), where esr is the effective series resistance of c out . ? i out also begins to discharge or charge c out , which generates a feedback error signal. the regulator loop then acts to return v out to its steady state value. during this recovery time v out can be monitored for overshoot or ringing that would indicate a stability problem.
upi confidential up1723 11 up1723-ds-p0001, jan. 2015 www.upi-semi.com pcb layout considerations high switching frequencies and relatively large peak currents make the pcb layout a very important part of switching mode power supply design. good design minimizes excessive emi on the feedback paths and voltage gradients in the ground plane, both of which can result in instability or regulation errors. follow the pcb layout guidelines for optimal performance of up1723. 1 for the main current paths, keep their traces short, direct and wide. 2 put the input/output capacitors as close as possible to the device pins. 3 lx node is with high frequency voltage swing and should be kept small area. keep analog components away from lx node to prevent stray capacitive noise pick-up. 4 connect feedback network behind the output capacitors. place the feedback components near the up1723 and keep the loop area small. . 5 a ground plane is preferred, but if not available, keep the signal and power grounds separated with small signal components returning to the gnd pin at one point. they should not share the high current path of c in or c out . 6 flood all unused areas on all layers with copper. flooding with copper will reduce the temperature rise of power components. these copper areas should be connected to v in or gnd. 7 an example of 2-layer pcb layout is shown in figure 1 for reference. 5 6 7 8 1 2 3 4 gnd via to boot via to c boot via to gnd vin plane vout plane figure 1. top layer layout example. application information
upi confidential up1723 12 up1723-ds-p0001, jan. 2015 www.upi-semi.com package information note 1.package outline unit description: bsc: basic. represents theoretical exact dimension or dimension target min: minimum dimension specified. max: maximum dimension specified. ref: reference. represents dimension for reference use only. this value is not a device specification. typ. typical. provided as a general value. this value is not a device specification. 2.dimensions in millimeters. 3.drawing not to scale. 4.these dimensions do not include mold flash or protrusions. mold flash or protrusions shall not exceed 0.15mm. sop - 8l 0.31 - 0.51 4.80 - 5.00 5.80 - 6.20 0.10 - 0.25 0.10 - 0.25 0.40 - 1.27 1.27 bsc 3.80 - 4.00 1.75 max 1
upi confidential up1723 13 up1723-ds-p0001, jan. 2015 www.upi-semi.com package information note 1.package outline unit description: bsc: basic. represents theoretical exact dimension or dimension target min: minimum dimension specified. max: maximum dimension specified. ref: reference. represents dimension for reference use only. this value is not a device specification. typ. typical. provided as a general value. this value is not a device specification. 2.dimensions in millimeters. 3.drawing not to scale. 4.these dimensions do not include mold flash or protrusions. mold flash or protrusions shall not exceed 0.15mm. psop - 8l 0.31 - 0.51 4.80 - 5.00 5.79 - 6.20 0.10 - 0.25 0.40 - 1.27 1.27 bsc 3.80 - 4.00 1.80 - 2.40 1.80 - 2.40 0.00 - 0.15 1.7 max 1
upi confidential up1723 14 up1723-ds-p0001, jan. 2015 www.upi-semi.com 0.22 - 0.38 0.00 - 0.15 0.08-0.23 0.40 - 0.80 0.65 bsc 1.10 max 1.40 - 2.15 1.30 - 1.90 2.90 - 3.10 4.80 - 5.00 2.90 - 3.10 package information note 1.package outline unit description: bsc: basic. represents theoretical exact dimension or dimension target min: minimum dimension specified. max: maximum dimension specified. ref: reference. represents dimension for reference use only. this value is not a device specification. typ. typical. provided as a general value. this value is not a device specification. 2.dimensions in millimeters. 3.drawing not to scale. 4.these dimensions do not include mold flash or protrusions. mold flash or protrusions shall not exceed 0.15mm. pmsop - 8l
upi confidential up1723 15 up1723-ds-p0001, jan. 2015 www.upi-semi.com package information note 1.package outline unit description: bsc: basic. represents theoretical exact dimension or dimension target min: minimum dimension specified. max: maximum dimension specified. ref: reference. represents dimension for reference use only. this value is not a device specification. typ. typical. provided as a general value. this value is not a device specification. 2.dimensions in millimeters. 3.drawing not to scale. 4.these dimensions do not include mold flash or protrusions. mold flash or protrusions shall not exceed 0.15mm. pmsop-10l 0.17-0.33 4.80 - 5.00 0.00 - 0.15 0.08-0.23 0.40 - 0.80 0.50 bsc 2.90 - 3.10 1.10 max 2.90 - 3.10 1.40-1.90 1.70 - 2.10
upi confidential up1723 16 up1723-ds-p0001, jan. 2015 www.upi-semi.com important notice upi and its subsidiaries reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. upi products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment. however, no res ponsibility is assumed by upi or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of upi or its subsidiaries. copyright ( c ) 2011, upi semiconductor corp. upi semiconductor corp. headquarter 9f.,no.5, taiyuan 1st st. zhubei city, hsinchu taiwan, r.o.c. tel : 886.3.560.1666 fax : 886.3.560.1888 upi semiconductor corp. sales branch office 12f-5, no. 408, ruiguang rd. neihu district, taipei taiwan, r.o.c. tel : 886.2.8751.2062 fax : 886.2.8751.5064

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